Tokyo Electron 2L08-050066-12印刷電路板 PDF資料
1.產(chǎn) 品 資 料 介 紹：
中文資料：
Tokyo Electron (TEL) 2L08-050066-12 印刷電路板 — 產(chǎn)品應(yīng)用領(lǐng)域詳解
一、產(chǎn)品功能定位
2L08-050066-12 印刷電路板（PCB）是 Tokyo Electron 半導(dǎo)體設(shè)備中的關(guān)鍵電子部件，通常用于承載控制邏輯、電源分配、信號(hào)處理等功能模塊，是設(shè)備內(nèi)部信號(hào)和電力傳輸?shù)幕A(chǔ)平臺(tái)。
二、主要應(yīng)用領(lǐng)域
1. 設(shè)備控制系統(tǒng)核心電路支撐
用作控制系統(tǒng)的主板或子板，承載 MCU、FPGA、I/O 控制芯片等關(guān)鍵元件；
實(shí)現(xiàn)晶圓處理設(shè)備（如刻蝕機(jī)、CVD、涂膠顯影機(jī)）中各子系統(tǒng)的邏輯控制與狀態(tài)協(xié)調(diào)。
2. 信號(hào)采集與接口轉(zhuǎn)換
集成多種傳感器接口、AD/DA 模塊、通信端口；
在設(shè)備中充當(dāng)橋梁，連接溫控系統(tǒng)、氣壓控制、馬達(dá)驅(qū)動(dòng)模塊等執(zhí)行部件與中央控制器。
3. 電源調(diào)配與穩(wěn)壓濾波功能
承載電源模塊和穩(wěn)壓電路，為其它功能板卡提供穩(wěn)定的低壓直流電源；
實(shí)現(xiàn)對(duì)不同電壓等級(jí)的分配、過載保護(hù)、電磁干擾抑制。
4. 系統(tǒng)通信與總線集成
提供設(shè)備內(nèi)部如 I2C、SPI、RS-485、CAN 等通信總線接口；
支持與主控系統(tǒng)及外部設(shè)備之間的高速數(shù)據(jù)交換。
三、典型應(yīng)用設(shè)備
等離子刻蝕系統(tǒng)（Etcher）
控制氣體流量、電極電壓、真空系統(tǒng)等環(huán)節(jié)。薄膜沉積設(shè)備（CVD、ALD）
管理溫度、時(shí)間、反應(yīng)物注入等工藝參數(shù)。涂膠顯影設(shè)備（Coater/Developer）
用于控制旋轉(zhuǎn)速度、顯影時(shí)間、曝光區(qū)域識(shí)別等。設(shè)備通訊中繼與數(shù)據(jù)分發(fā)節(jié)點(diǎn)
可作為系統(tǒng)內(nèi)多個(gè)子模塊的通信節(jié)點(diǎn)，提高數(shù)據(jù)協(xié)調(diào)效率。
英文資料：
Tokyo Electron (TEL) 2L08-05006-12 Printed Circuit Board - Detailed Explanation of Product Application Fields
1、 Product functional positioning
The 2L08-050066-12 printed circuit board (PCB) is a critical electronic component in Tokyo Electron semiconductor equipment, typically used to carry functional modules such as control logic, power distribution, and signal processing. It serves as the foundational platform for internal signal and power transmission within the equipment.
2、 Main application areas
1. Core circuit support for equipment control system
Used as a motherboard or daughter board for control systems, carrying key components such as MCU, FPGA, I/O control chips, etc;
Implement logical control and state coordination of various subsystems in wafer processing equipment (such as etching machines, CVD, coating and developing machines).
2. Signal acquisition and interface conversion
Integrate multiple sensor interfaces, AD/DA modules, and communication ports;
Act as a bridge in the device, connecting the execution components such as temperature control system, air pressure control, motor drive module, etc. with the central controller.
3. Power allocation and voltage regulation filtering function
Carrying power modules and stabilizing circuits, providing stable low-voltage DC power for other functional boards;
Realize the allocation of different voltage levels, overload protection, and electromagnetic interference suppression.
4. System communication and bus integration
Provide internal communication bus interfaces such as I 2 C, SPI, RS-485, CAN, etc;
Support high-speed data exchange between the main control system and external devices.
3、 Typical application devices
Plasma etching system (Etcher)
Control gas flow rate, electrode voltage, vacuum system and other aspects.
Thin film deposition equipment (CVD, ALD)
Manage process parameters such as temperature, time, and reactant injection.
Coater/Developer
Used to control rotation speed, development time, exposure area recognition, etc.
Device communication relay and data distribution node
Can serve as a communication node for multiple sub modules within the system, improving data coordination efficiency.
2.產(chǎn) 品 展 示
3.其他產(chǎn)品
ABB CHBX01R 2VAA008575R1 冗余模塊底座
MOTOROLA MVME2604761 IO系統(tǒng)模塊
4.其他英文產(chǎn)品
GE 151X1235DB15SA01 power converter
GE IS200TRLYH1B power converter
ASEA DSQC108 controller backplane
| 4145J42-G01 | P81010Z1200002 | PFCL 201CE-5.0KN |
| 4136J63G1 | HG96A603 | TRICONEX 3664 |
| 4136J63-G01 | SS7PG-48BMC | IMDSI22 |
| 40PA60-36-37-TEFC-G | HG932A6 | IMDSM04 |
| 40PA59-55-TEFC-S | 193X735ACG01 | 067-10098-0000 |
| 40PA58-53-TEFC-S | PRD-SC30000Z-41 | 0AF00 |
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