Tokyo Electron 2180-021279-11印刷電路板 PDF資料
1.產(chǎn) 品 資 料 介 紹：
中文資料：
Tokyo Electron (TEL) 2180-021279-11 印刷電路板 — 產(chǎn)品應(yīng)用領(lǐng)域詳解
一、產(chǎn)品功能定位
2180-021279-11 印刷電路板（PCB） 是 Tokyo Electron（TEL）半導(dǎo)體設(shè)備內(nèi)部的重要電子組件，用于承載、連接并驅(qū)動(dòng)各類(lèi)電子元器件。此 PCB 板在系統(tǒng)中通常負(fù)責(zé)信號(hào)處理、功能邏輯執(zhí)行或設(shè)備控制橋接，是控制系統(tǒng)與執(zhí)行單元間實(shí)現(xiàn)高可靠性、高速數(shù)據(jù)傳輸?shù)年P(guān)鍵載體。
二、主要應(yīng)用領(lǐng)域
1. 設(shè)備控制子系統(tǒng)中的核心功能板卡
典型功能：
處理數(shù)字/模擬信號(hào)，完成邏輯控制、放大、濾波、轉(zhuǎn)換等操作；
擔(dān)任控制器模塊的輔助單元或獨(dú)立子系統(tǒng)中的主控板；
與溫控、電機(jī)驅(qū)動(dòng)、氣體控制、真空系統(tǒng)等功能模塊協(xié)作。
應(yīng)用設(shè)備：
CVD、ALD、Etcher 等主機(jī)內(nèi)部；
晶圓搬運(yùn)與傳輸系統(tǒng)；
晶圓檢測(cè)、監(jiān)控單元；
溫度、氣壓、流量等工藝控制回路。
2. 信號(hào)橋接與子系統(tǒng)通信平臺(tái)
信號(hào)接口類(lèi)型：
數(shù)字 I/O、模擬 I/O、RS-232/422、CAN、以太網(wǎng)或?qū)Ｓ猛ㄐ艆f(xié)議；
可連接控制器模塊、電源板、傳感器、執(zhí)行器、閥組等；
主要職責(zé)：
實(shí)現(xiàn)系統(tǒng)內(nèi)多個(gè)模塊的數(shù)據(jù)通信與協(xié)同控制；
對(duì)接人機(jī)界面（HMI）或主機(jī)軟件系統(tǒng)，上傳設(shè)備狀態(tài)與運(yùn)行參數(shù)。
英文資料：
Tokyo Electron (TEL) 2180-021279-11 Printed Circuit Board - Detailed Explanation of Product Application Fields
1、 Product functional positioning
2180-021279-11 Printed Circuit Board (PCB) is an important electronic component inside Tokyo Electron (TEL) semiconductor equipment, used to carry, connect, and drive various electronic components. This PCB board is usually responsible for signal processing, functional logic execution, or device control bridging in the system, and is a key carrier for achieving high reliability and high-speed data transmission between the control system and the execution unit.
2、 Main application areas
1. Core functional board in the equipment control subsystem
Typical functions:
Process digital/analog signals, complete logic control, amplification, filtering, conversion and other operations;
Serve as the auxiliary unit of the controller module or the main control board in an independent subsystem;
Collaborate with functional modules such as temperature control, motor drive, gas control, vacuum system, etc.
Application devices:
Internal components of CVD, ALD, Etcher and other hosts;
Wafer handling and transportation system;
Wafer inspection and monitoring unit;
Process control circuits for temperature, air pressure, flow rate, etc.
2. Signal bridging and subsystem communication platform
Signal interface type:
Digital I/O, analog I/O, RS-232/422, CAN, Ethernet, or dedicated communication protocols;
Can connect controller modules, power boards, sensors, actuators, valve groups, etc;
Main responsibilities:
Implement data communication and collaborative control among multiple modules within the system;
Docking with human-machine interface (HMI) or host software system, uploading device status and operating parameters.
2.產(chǎn) 品 展 示
3.其他產(chǎn)品
IS200DTAIH1ABB雙系統(tǒng)監(jiān)測(cè)模塊
ABB PL810P?3BDH000311R0101 電源鏈接模塊
4.其他英文產(chǎn)品
AMAT 0190-66253 Communication Module
IC3600SVZB1 Computer Adjustmen
ASEA 57360001-AN circuit board
| 2VM61-000-3 | PPC611100 | IC3600TPSB1 |
| 2VM61-000-2 | SR1000-000000 | IMDSM05 |
| 2VM61-000-1 | PSR3-23075-25-202 | 710-658268-20 |
| 2VM52-020-6 | P325 | 710-612545-004 |
| 2VM52-000-11 | SV3405-11000 | F31X133PRUAKG1 |
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