Tokyo Electron 2L81-000001-14接口PCB PDF資料
1.產(chǎn) 品 資 料 介 紹：
中文資料：
TEL Tokyo Electron 2L81-000001-14 接口 PCB
（Interface Printed Circuit Board）
產(chǎn)品功能簡介：
該接口 PCB 是 TEL（Tokyo Electron）半導體制造設備中用于電信號連接、數(shù)據(jù)傳輸與控制模塊通信的專用電路板。主要功能包括：
在設備主控單元與外圍子模塊之間建立物理連接與數(shù)據(jù)通道
管理多路數(shù)字/模擬 I/O 信號的接收與分發(fā)
提供標準接口（如高速通信口、GPIO、串口、現(xiàn)場總線等）
在一定程度上承擔信號隔離、調理、轉換等功能
支持與執(zhí)行機構、傳感器、顯示模塊或其他 PCB 的互聯(lián)互通
主要應用領域：
1. 設備控制信號分發(fā)中心
用于 TEL 設備中主控系統(tǒng)與執(zhí)行單元之間的信號接口樞紐
連接如驅動板、電機控制板、加熱器、真空閥、傳感器等外圍設備
2. 晶圓搬運與對位模塊
管理 EFEM、Load Port、Transfer Module 等子系統(tǒng)的控制/反饋信號
實現(xiàn)晶圓傳輸過程中的精確同步與信號交換
3. 數(shù)據(jù)通信橋接模塊
實現(xiàn)高速信號中繼與接口電平匹配
支持與 TEL 內部總線結構或工廠網(wǎng)絡系統(tǒng)通信
4. 模塊化系統(tǒng)結構中的互連平臺
允許不同功能電路板通過接口 PCB 統(tǒng)一連接到設備控制總線或背板
支持系統(tǒng)擴展或模塊替換，提高設備維護靈活性
英文資料：
TEL Tokyo Electron 2L81-000001-14 Interface PCB
（Interface Printed Circuit Board）
Product Function Introduction:
This interface PCB is a dedicated circuit board used for electrical signal connection, data transmission, and control module communication in TEL (Tokyo Electron) semiconductor manufacturing equipment. The main functions include:
Establish physical connections and data channels between the main control unit of the device and the peripheral submodules
Manage the reception and distribution of multiple digital/analog I/O signals
Provide standard interfaces (such as high-speed communication port, GPIO, serial port, fieldbus, etc.)
To a certain extent, it undertakes functions such as signal isolation, conditioning, and conversion
Support interconnection and interoperability with actuators, sensors, display modules, or other PCBs
Main application areas:
1. Equipment Control Signal Distribution Center
Used as a signal interface hub between the main control system and the execution unit in TEL devices
Connect peripheral devices such as drive boards, motor control boards, heaters, vacuum valves, sensors, etc
2. Wafer handling and alignment module
Manage control/feedback signals for subsystems such as EFEM, Load Port, Transfer Module, etc
Realize precise synchronization and signal exchange during wafer transfer process
3. Data Communication Bridge Module
Realize high-speed signal relay and interface level matching
Support communication with TEL internal bus structure or factory network system
4. Interconnection Platform in Modular System Architecture
Allow different functional circuit boards to be uniformly connected to the device control bus or backplane through interface PCBs
Support system expansion or module replacement to improve equipment maintenance flexibility
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