Tokyo Electron CT2980-092273-11傳感器模塊 PDF資料
1.產(chǎn) 品 資 料 介 紹:
中文資料:
TEL Tokyo Electron CT2980-092273-11 傳感器模塊
(Sensor Module)
產(chǎn)品定義與功能:
該模塊是 Tokyo Electron(東京電子)在其半導(dǎo)體設(shè)備中使用的高精度傳感器集成單元,用于實(shí)時(shí)監(jiān)測(cè)設(shè)備運(yùn)行狀態(tài)或加工環(huán)境參數(shù)。其核心功能包括:
檢測(cè)與采集:監(jiān)控關(guān)鍵物理量(如位置、溫度、壓力、真空度、流量、對(duì)位狀態(tài)等)
信號(hào)轉(zhuǎn)換:將模擬信號(hào)轉(zhuǎn)換為數(shù)字信號(hào)并傳輸至控制系統(tǒng)
數(shù)據(jù)反饋:提供實(shí)時(shí)反饋用于閉環(huán)控制與設(shè)備保護(hù)
集成通信:與主控系統(tǒng)、PLC 或 I/O 模塊通信,支持設(shè)備內(nèi)部邏輯聯(lián)動(dòng)
主要應(yīng)用領(lǐng)域:
1. 晶圓處理監(jiān)測(cè)
用于晶圓在傳輸、裝載、對(duì)準(zhǔn)等過(guò)程中的位置和狀態(tài)檢測(cè)
常配合 EFEM、Load Port、Transfer Module 使用,提升操作精度與穩(wěn)定性
2. 真空/氣體控制系統(tǒng)
監(jiān)測(cè)腔體內(nèi)真空度、氣體流量或氣壓變化
與 MFC(質(zhì)量流量控制器)、真空閥等設(shè)備聯(lián)動(dòng),實(shí)現(xiàn)安全聯(lián)鎖控制
3. 溫度與環(huán)境監(jiān)測(cè)
用于加熱模塊、冷卻裝置或等離子處理區(qū)域的溫度檢測(cè)
保障工藝過(guò)程參數(shù)在穩(wěn)定范圍內(nèi)運(yùn)行
4. 自動(dòng)化故障診斷與報(bào)警
實(shí)現(xiàn)故障狀態(tài)檢測(cè)(如門(mén)未閉合、對(duì)位失敗、氣壓異常)
支持設(shè)備自檢、遠(yuǎn)程報(bào)警和日志記錄功能
英文資料:
TEL Tokyo Electron CT2980-092273-11 Sensor Module
(Sensor Module)
Product definition and functionality:
This module is a high-precision sensor integrated unit used by Tokyo Electron in its semiconductor equipment for real-time monitoring of equipment operating status or processing environment parameters. Its core functions include:
Detection and collection: Monitor key physical quantities (such as position, temperature, pressure, vacuum degree, flow rate, alignment status, etc.)
Signal conversion: Convert analog signals into digital signals and transmit them to the control system
Data feedback: Provide real-time feedback for closed-loop control and equipment protection
Integrated communication: communicates with the main control system, PLC or I/O module, supports internal logical linkage of equipment
Main application areas:
1. Wafer processing monitoring
Used for detecting the position and status of wafers during transportation, loading, alignment, and other processes
Frequently used in conjunction with EFEM, Load Port, and Transfer Module to improve operational accuracy and stability
2. Vacuum/gas control system
Monitor the vacuum degree, gas flow rate, or pressure changes inside the chamber
Linkage with MFC (Mass Flow Controller), vacuum valve and other equipment to achieve safety interlock control
3. Temperature and environmental monitoring
Temperature detection for heating modules, cooling devices, or plasma processing areas
Ensure that the process parameters operate within a stable range
4. Automated fault diagnosis and alarm
Implement fault state detection (such as door not closed, alignment failure, abnormal air pressure)
Support device self check, remote alarm, and logging functions
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