Tokyo Electron 1D08-000299-11連接模塊 PDF資料
1.產(chǎn) 品 資 料 介 紹:
中文資料:
TEL Tokyo Electron 1D08-000299-11 連接模塊
(Connection Module)
產(chǎn)品定位與作用:
該模塊是 TEL(Tokyo Electron)設(shè)備中的一種電氣與信號(hào)連接接口組件,用于在設(shè)備各子系統(tǒng)之間實(shí)現(xiàn)可靠、清晰的信號(hào)、電源或數(shù)據(jù)連接,其主要功能包括:
信號(hào)/電源的物理連接與分布
作為主控系統(tǒng)與子模塊之間的連接橋梁
支持?jǐn)?shù)據(jù)、控制、通信信號(hào)的路由與轉(zhuǎn)接
實(shí)現(xiàn)模塊化接插設(shè)計(jì),便于系統(tǒng)維護(hù)與替換
主要應(yīng)用領(lǐng)域:
1. 設(shè)備內(nèi)部子系統(tǒng)互連
用于主控系統(tǒng)(Controller)與 I/O 板、傳感器、執(zhí)行器之間的信號(hào)橋接
整合多個(gè)信號(hào)線纜,統(tǒng)一連接到主系統(tǒng)總線或背板上
2. 模塊化設(shè)備架構(gòu)連接接口
用于快速安裝與拆卸不同功能模塊,支持即插即用型設(shè)計(jì)
常用于 EFEM(前端模塊)、Transfer Modules、Load Ports 等可更換組件之間的連接
3. 電源與通信通道整合
將來自電源模塊或通信接口板的線路集中連接到指定目標(biāo)模塊
支持低壓直流供電(如 +5V、+12V、+24V)和工業(yè)通信協(xié)議(如RS-232/485、CAN、TTL)
4. 系統(tǒng)信號(hào)屏蔽與干擾抑制
某些型號(hào)連接模塊具備抗 EMI / ESD 特性
有助于在高頻或真空環(huán)境中保障信號(hào)完整性
英文資料:
TEL Tokyo Electron 1D08-000299-11 Connection Module
(Connection Module)
Product positioning and function:
This module is an electrical and signal connection interface component in TEL (Tokyo Electron) equipment, used to achieve reliable and clear signal, power or data connections between various subsystems of the equipment. Its main functions include:
Physical connection and distribution of signals/power supply
As a connecting bridge between the main control system and sub modules
Support routing and transfer of data, control, and communication signals
Implement modular plug-in design for easy system maintenance and replacement
Main application areas:
1. Interconnection of subsystems within the device
Used for signal bridging between the main control system (Controller) and I/O boards, sensors, and actuators
Integrate multiple signal cables and connect them uniformly to the main system bus or backplane
2. Modular device architecture connection interface
Used for quick installation and removal of different functional modules, supporting plug and play design
Commonly used for connecting replaceable components such as EFEM (Front End Modules), Transfer Modules, Load Ports, etc
3. Integration of power supply and communication channels
Connect the lines from the power module or communication interface board to the designated target module in a centralized manner
Supports low-voltage DC power supply (such as+5V,+12V,+24V) and industrial communication protocols (such as RS-232/485, CAN, TTL)
4. System signal shielding and interference suppression
Some models of connection modules have anti EMI/ESD characteristics
Helps to ensure signal integrity in high-frequency or vacuum environments
2.產(chǎn) 品 展 示
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