Tokyo Electron 3M87-024252-23控制器模塊 PDF資料
1.產(chǎn) 品 資 料 介 紹：
中文資料：
TEL Tokyo Electron 3M87-024252-23 控制器模塊 是一款應(yīng)用于半導(dǎo)體制造設(shè)備中的控制核心單元模塊，主要用于對設(shè)備各個功能模塊（如氣體系統(tǒng)、溫控系統(tǒng)、運動機構(gòu)等）進行統(tǒng)一管理、邏輯運算和控制指令下發(fā)，是實現(xiàn)自動化精密工藝控制的關(guān)鍵組成部分。
一、基本信息
產(chǎn)品型號： 3M87-024252-23
產(chǎn)品名稱： 控制器模塊（Controller Module）
制造商： Tokyo Electron Ltd.（TEL）
模塊類型： 嵌入式控制系統(tǒng)組件 / 工藝控制卡件
適用平臺： 可能用于 TEL 的涂膠顯影（Coater/Developer）、CVD、Etcher 或 ALD 系統(tǒng)等。
二、核心功能
工藝流程控制
運行 TEL 設(shè)備控制邏輯，用于管理各工藝步驟的啟停、切換、計時、同步等。
外圍模塊協(xié)調(diào)
與 I/O 板、氣閥控制板、驅(qū)動模塊、溫控板等協(xié)同工作，執(zhí)行邏輯動作控制。
設(shè)備狀態(tài)監(jiān)控與反饋
實時采集各子系統(tǒng)的運行狀態(tài)，并根據(jù)設(shè)定條件作出判斷、反饋或報警。
與主系統(tǒng)通信
通過系統(tǒng)總線（如 TEL 專用總線、Ethernet、CAN 等）與主機或上位系統(tǒng)交互數(shù)據(jù)。
嵌入式程序運行
內(nèi)部可能搭載嵌入式處理器與固化軟件，用于執(zhí)行特定工藝控制程序。
三、典型應(yīng)用領(lǐng)域
涂膠顯影系統(tǒng)（Coater/Developer）
控制晶圓傳輸、旋轉(zhuǎn)、涂膠、顯影步驟的節(jié)拍與條件判斷。
CVD / ALD 設(shè)備
管理反應(yīng)氣體的切換、溫度設(shè)定、沉積過程的節(jié)拍邏輯。
等離子蝕刻系統(tǒng)
控制等離子源開啟/關(guān)閉、RF電源狀態(tài)、腔體氣壓與氣流調(diào)節(jié)等關(guān)鍵參數(shù)。
后段封裝/清洗模塊
實現(xiàn)流體/溶液控制、泵閥切換、循環(huán)時間控制、廢液排放等操作管理。
英文資料：
The TEL Tokyo Electron 3M87-024252-23 controller module is a control core unit module used in semiconductor manufacturing equipment. It is mainly used for unified management, logical operation, and control instruction issuance of various functional modules of the equipment (such as gas system, temperature control system, motion mechanism, etc.), and is a key component for achieving automated precision process control.
1、 Basic Information
Product model: 3M87-024252-23
Product Name: Controller Module
Manufacturer: Tokyo Electron Ltd. (TEL)
Module Type: Embedded Control System Components/Process Control Cards
Applicable platforms: May be used for TEL coating/developer, CVD, Etcher, or ALD systems, etc.
2、 Core functions
Process control
Run TEL device control logic to manage the start stop, switching, timing, synchronization, etc. of each process step.
Peripheral module coordination
Collaborate with I/O board, air valve control board, driver module, temperature control board, etc. to execute logical action control.
Equipment status monitoring and feedback
Real time collection of the operating status of each subsystem, and making judgments, feedback, or alarms based on set conditions.
Communicate with the main system
Interact data with the host or upper system through system buses such as TEL dedicated buses, Ethernet, CAN, etc.
Embedded program running
Internally, it may be equipped with embedded processors and fixed software for executing specific process control programs.
3、 Typical application areas
Coater/Developer system
Control the rhythm and condition judgment of wafer transfer, rotation, coating, and development steps.
CVD/ALD equipment
Manage the switching of reaction gases, temperature settings, and the rhythm logic of the deposition process.
Plasma etching system
Control key parameters such as plasma source on/off, RF power status, chamber pressure and airflow regulation.
Rear packaging/cleaning module
Implement fluid/solution control, pump valve switching, circulation time control, waste liquid discharge and other operational management.
2.產(chǎn) 品 展 示
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