Tokyo Electron E281-000029-12 PCB背板 PDF資料
1.產(chǎn) 品 資 料 介 紹：
中文資料：
TEL Tokyo Electron E281-000029-12 PCB 背板 是一款用于半導(dǎo)體設(shè)備中的印刷電路背板（Backplane PCB），在系統(tǒng)中承擔(dān)模塊化組件之間的電氣連接與通信功能。該背板是多個(gè)功能模塊（如 CPU 模塊、I/O 模塊、電源模塊等）的基礎(chǔ)支撐平臺，確保各子模塊能夠在同一總線架構(gòu)下協(xié)同工作。
一、產(chǎn)品基本信息
產(chǎn)品型號： E281-000029-12
產(chǎn)品名稱： PCB 背板 / Backplane PCB
制造商： Tokyo Electron Ltd.（TEL）
應(yīng)用類型： 系統(tǒng)總線連接平臺，用于多個(gè)控制模塊的集成和互連
二、功能作用
模塊插槽連接
提供多個(gè)模塊（如 CPU、DI/DO、驅(qū)動(dòng)器、電源板等）物理安裝與電氣連接的插槽或接口。
一般通過金手指或DIN插座與模塊卡件對接。
系統(tǒng)內(nèi)部通信
實(shí)現(xiàn)多模塊間的數(shù)據(jù)交換（如 TTL、RS485、CAN、VME、PXI等總線協(xié)議），是整個(gè)控制系統(tǒng)的數(shù)據(jù)骨干。
電源與信號分配
為各模塊提供電源分配（如 +5V、+12V、+24V 等）；
分發(fā)控制信號和系統(tǒng)時(shí)鐘脈沖等同步信號。
結(jié)構(gòu)支持功能
作為模塊框架的一部分，提供模塊卡件的固定與導(dǎo)向功能，增強(qiáng)設(shè)備結(jié)構(gòu)可靠性。
三、應(yīng)用領(lǐng)域
E281-000029-12 背板 主要用于以下 TEL 設(shè)備與系統(tǒng)平臺中：
半導(dǎo)體工藝設(shè)備控制系統(tǒng)
包括 CVD、Etcher、Track、Coater/Developer、Wet Bench 等核心設(shè)備。
控制模塊集成系統(tǒng)
安裝在電控機(jī)箱內(nèi)部，用于整合各功能板卡，實(shí)現(xiàn)一體化信號控制與管理。
高可靠工業(yè)自動(dòng)化平臺
可配合 TEL 定制主控平臺或第三方工業(yè)控制計(jì)算機(jī)共同使用。
英文資料：
TEL Tokyo Electron E281-000029-12 PCB Backplane is a printed circuit backplane (Backplane PCB) used in semiconductor devices, responsible for electrical connections and communication between modular components in the system. This backplane is the basic support platform for multiple functional modules (such as CPU modules, I/O modules, power modules, etc.), ensuring that each submodule can work together under the same bus architecture.
1、 Basic Product Information
Product model: E281-000029-12
Product Name: PCB Backplane PCB
Manufacturer: Tokyo Electron Ltd. (TEL)
Application type: System bus connection platform, used for integration and interconnection of multiple control modules
2、 Functional function
Module slot connection
Provide slots or interfaces for physical installation and electrical connection of multiple modules (such as CPU, DI/DO, drivers, power boards, etc.).
Generally, it is connected to the module card through a gold finger or DIN socket.
Internal communication within the system
Implementing data exchange between multiple modules (such as TTL, RS485, CAN, VME, PXI and other bus protocols) is the data backbone of the entire control system.
Power and signal distribution
Provide power distribution for each module (such as+5V,+12V,+24V, etc.);
Distribute control signals and synchronization signals such as system clock pulses.
Structural support function
As part of the module framework, it provides the fixing and guiding functions of module cards to enhance the reliability of equipment structure.
3、 Application Fields
The E281-000029-12 backplane is mainly used in the following TEL devices and system platforms:
Semiconductor process equipment control system
Including core equipment such as CVD, Etcher, Track, Coater/Developer, Wet Bench, etc.
Control module integration system
Installed inside the electronic control chassis, it is used to integrate various functional boards and achieve integrated signal control and management.
High reliability industrial automation platform
Can be used in conjunction with TEL customized main control platform or third-party industrial control computers.
2.產(chǎn) 品 展 示
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