Tokyo Electron 3208-000171-13控制器模塊 PDF資料
1.產(chǎn) 品 資 料 介 紹：
中文資料：
TEL Tokyo Electron 3208-000171-13 控制器模塊 是一款專用于東京電子（TEL）半導體制造設(shè)備的嵌入式控制核心部件，主要用于管理、協(xié)調(diào)設(shè)備中各子系統(tǒng)的運行邏輯，執(zhí)行工藝流程控制、數(shù)據(jù)采集處理及通信調(diào)度等關(guān)鍵功能，是整臺設(shè)備的大腦之一。
一、產(chǎn)品概述
| 項目 | 內(nèi)容 |
|---|---|
| 產(chǎn)品名稱 | 控制器模塊（Controller Module） |
| 產(chǎn)品型號 | 3208-000171-13 |
| 制造廠商 | Tokyo Electron Ltd.（東京電子） |
| 功能類型 | 中央邏輯控制與任務調(diào)度 |
二、核心功能
主控邏輯處理
內(nèi)嵌工業(yè)級 CPU 或 FPGA 控制單元，負責運行設(shè)備主控程序；
管理溫度控制、壓力調(diào)節(jié)、傳感器采集、動作邏輯等系統(tǒng)任務。
數(shù)據(jù)采集與通訊接口
與模擬輸入模塊、數(shù)字輸出模塊、IO板、PLC子系統(tǒng)等進行多通道信號交互；
支持TEL設(shè)備內(nèi)部通信協(xié)議及外部接口（可能包括RS-232/485、Ethernet、CAN等）。
工藝流程管理
執(zhí)行預設(shè)工藝流程順序，確保設(shè)備各階段動作精準銜接；
支持參數(shù)化設(shè)置、自動化控制、異常檢測與報警響應。
三、典型應用領(lǐng)域
涂膠顯影設(shè)備（Coater/Developer）
控制涂膠旋轉(zhuǎn)速度、臂機構(gòu)移動、顯影液輸送、加熱/冷卻等動作。
蝕刻與沉積設(shè)備（Etcher/CVD/ALD）
管理氣體流程、等離子功率、溫控系統(tǒng)與真空腔體的聯(lián)動邏輯。
晶圓搬運系統(tǒng)
協(xié)調(diào)真空腔門、機械臂、升降平臺等動作，實現(xiàn)晶圓從一個工藝單元精準轉(zhuǎn)移到下一個。
英文資料：
The TEL Tokyo Electron 3208-000171-13 controller module is an embedded control core component specifically designed for Tokyo Electronics (TEL) semiconductor manufacturing equipment. It is mainly used to manage and coordinate the operational logic of various subsystems in the equipment, perform key functions such as process flow control, data acquisition and processing, and communication scheduling. It is one of the brains of the entire equipment.
1、 Product Overview
Project Content
Product Name Controller Module
Product model 3208-000171-13
Manufacturer Tokyo Electron Ltd
Function type: Central logic control and task scheduling
2、 Core functions
Main control logic processing
Embedded industrial grade CPU or FPGA control unit, responsible for running the main control program of the equipment;
Manage system tasks such as temperature control, pressure regulation, sensor acquisition, and action logic.
Data collection and communication interface
Multi channel signal interaction with analog input modules, digital output modules, IO boards, PLC subsystems, etc;
Supports internal communication protocols and external interfaces of TEL devices (which may include RS-232/485, Ethernet, CAN, etc.).
Process management
Execute the preset process sequence to ensure precise connection of equipment actions in each stage;
Support parameterized settings, automated control, anomaly detection, and alarm response.
3、 Typical application areas
Coater/Developer
Control the rotation speed of the glue coating, the movement of the arm mechanism, the transportation of the developer solution, heating/cooling, and other actions.
Etching and deposition equipment (Etcher/CVD/ALD)
Manage the linkage logic between gas processes, plasma power, temperature control systems, and vacuum chambers.
Wafer handling system
Coordinate the actions of vacuum chamber doors, robotic arms, lifting platforms, etc., to achieve precise transfer of wafers from one process unit to the next.
2.產(chǎn) 品 展 示
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