Tokyo Electron TPC-T0064A-11接口板PCB PDF資料
1.產(chǎn) 品 資 料 介 紹:
中文資料:
TEL Tokyo Electron TPC-T0064A-11 接口板PCB 是一款用于東京電子(TEL)半導(dǎo)體制造設(shè)備內(nèi)部的關(guān)鍵通信連接模塊,主要用于信號傳輸、數(shù)據(jù)中繼和功能板卡之間的接口匹配,是控制系統(tǒng)實現(xiàn)多模塊聯(lián)動和穩(wěn)定通信的基礎(chǔ)橋梁之一。
一、產(chǎn)品概述
項目 | 內(nèi)容 |
---|---|
產(chǎn)品名稱 | 接口板 / 印刷電路板(Interface PCB Board) |
產(chǎn)品型號 | TPC-T0064A-11 |
制造廠商 | Tokyo Electron Ltd.(東京電子) |
功能類型 | 多通道接口連接與信號路由 |
二、核心功能
信號接口橋接
提供多組輸入輸出接口,用于連接主控板、I/O模塊、傳感器、驅(qū)動器等;
支持?jǐn)?shù)字信號、模擬信號及部分通信信號(如TTL、RS-422、光耦信號)中繼。
電氣隔離與穩(wěn)定傳輸
模塊上可能集成隔離元件,如光耦、電容屏蔽等,提升抗干擾能力;
確保在高速通信或復(fù)雜環(huán)境下的數(shù)據(jù)傳輸穩(wěn)定性。
功能模塊互聯(lián)平臺
將上位控制系統(tǒng)(如CPU主板)與執(zhí)行層(如加熱單元、氣閥、電機)有效連接;
支持模塊化布線設(shè)計,便于設(shè)備結(jié)構(gòu)靈活配置和后期維護(hù)。
三、應(yīng)用場景
晶圓處理設(shè)備控制系統(tǒng)
在涂膠顯影、蝕刻、離子注入、清洗等設(shè)備中,用于主控與執(zhí)行模塊間的電信號接口。
復(fù)雜自動化系統(tǒng)的信號分布中心
作為信號中繼節(jié)點,用于連接多個子板卡并集中布線,簡化系統(tǒng)接線結(jié)構(gòu)。
工藝控制輔助電路
支持部分溫度、壓力、光學(xué)傳感器等外圍電路與主板數(shù)據(jù)同步。
英文資料:
The TEL Tokyo Electron TPC-T0064A-11 interface board PCB is a key communication connection module used within Tokyo Electronics (TEL) semiconductor manufacturing equipment. It is mainly used for signal transmission, data relay, and interface matching between functional boards. It is one of the basic bridges for control systems to achieve multi module linkage and stable communication.
1、 Product Overview
Project Content
Product Name: Interface PCB Board
Product model TPC-T0064A-11
Manufacturer Tokyo Electron Ltd
Function type: Multi channel interface connection and signal routing
2、 Core functions
Signal interface bridging
Provide multiple sets of input/output interfaces for connecting the main control board, I/O modules, sensors, drivers, etc;
Supports the relay of digital signals, analog signals, and some communication signals (such as TTL, RS-422, optocoupler signals).
Electrical isolation and stable transmission
Isolation components such as optocouplers and capacitor shields may be integrated on the module to enhance anti-interference capabilities;
Ensure data transmission stability in high-speed communication or complex environments.
Functional module interconnection platform
Effectively connect the upper control system (such as CPU motherboard) with the execution layer (such as heating unit, air valve, motor);
Support modular wiring design, facilitating flexible configuration and later maintenance of equipment structure.
3、 Application scenarios
Wafer processing equipment control system
Used as an electrical signal interface between the main control and execution modules in equipment such as adhesive development, etching, ion implantation, and cleaning.
Signal distribution center of complex automation systems
As a signal relay node, it is used to connect multiple sub boards and centralize wiring, simplifying the system wiring structure.
Process control auxiliary circuit
Support synchronization of peripheral circuits such as temperature, pressure, and optical sensors with motherboard data.
2.產(chǎn) 品 展 示
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