Tokyo Electron SVB-20MVE-ADV2信號(hào)總線背板 PDF資料
1.產(chǎn) 品 資 料 介 紹:
中文資料:
TEL Tokyo Electron SVB-20MVE-ADV2 信號(hào)總線背板 是東京電子(TEL)半導(dǎo)體設(shè)備內(nèi)部用于模塊間通信和電氣連接的高性能背板模塊,主要作為多個(gè)功能板卡的通信平臺(tái)和電源分發(fā)中心。它構(gòu)成了設(shè)備電子系統(tǒng)的“骨干通道”,對(duì)整體控制系統(tǒng)的穩(wěn)定運(yùn)行具有關(guān)鍵意義。
一、產(chǎn)品基本信息
項(xiàng)目 | 內(nèi)容 |
---|---|
產(chǎn)品名稱 | 信號(hào)總線背板(Signal Bus Backplane) |
產(chǎn)品型號(hào) | SVB-20MVE-ADV2 |
制造廠商 | Tokyo Electron Ltd.(東京電子) |
模塊類型 | 背板式通信與電源接口平臺(tái) |
二、主要功能
信號(hào)傳輸平臺(tái)
提供統(tǒng)一的數(shù)據(jù)總線結(jié)構(gòu),實(shí)現(xiàn)多個(gè)功能模塊之間的高效信號(hào)交換;
支持?jǐn)?shù)字信號(hào)、模擬信號(hào)和控制信號(hào)的統(tǒng)一路由。
模塊化接口支持
設(shè)計(jì)有多個(gè)標(biāo)準(zhǔn)插槽(如VME、CPCI等),支持控制卡件、I/O卡件、監(jiān)控模塊等直接插入;
每個(gè)插槽具有標(biāo)準(zhǔn)化的信號(hào)/電源接口,保證即插即用與維護(hù)便利。
電源分配與保護(hù)
背板內(nèi)部集成了電源軌道,可為多個(gè)板卡提供不同電壓等級(jí)的穩(wěn)定供電(如±12V、+5V、+3.3V);
同時(shí)具備電源過流/短路保護(hù)機(jī)制,提升系統(tǒng)整體可靠性。
三、應(yīng)用領(lǐng)域
半導(dǎo)體設(shè)備主控系統(tǒng)
應(yīng)用于TEL的涂膠顯影、蝕刻、清洗、熱處理等設(shè)備中的中央控制架構(gòu);
承載控制CPU板、I/O模塊、溫控卡件、通信接口等多個(gè)功能單元。
工藝自動(dòng)化控制平臺(tái)
在多板協(xié)同工作的系統(tǒng)中作為主通信載體,維持高帶寬、高穩(wěn)定的信號(hào)通道;
支持復(fù)雜動(dòng)作流程中的實(shí)時(shí)響應(yīng)和多任務(wù)處理。
設(shè)備維護(hù)與模塊化擴(kuò)展
便于更換或擴(kuò)展功能板卡,無需大幅改動(dòng)設(shè)備結(jié)構(gòu);
是設(shè)備長(zhǎng)期運(yùn)行中不可缺少的結(jié)構(gòu)部件之一。
英文資料:
The TEL Tokyo Electron SVB-20MVE-ADV2 signal bus backplane is a high-performance backplane module used for inter module communication and electrical connections within Tokyo Electronics (TEL) semiconductor equipment. It mainly serves as a communication platform and power distribution center for multiple functional boards. It constitutes the "backbone channel" of the device electronic system and is of crucial importance for the stable operation of the overall control system.
1、 Basic Product Information
Project Content
Product Name: Signal Bus Backplane
Product model SVB-20MVE-ADV2
Manufacturer Tokyo Electron Ltd
Module type Backplane communication and power interface platform
2、 Main functions
Signal transmission platform
Provide a unified data bus structure to achieve efficient signal exchange between multiple functional modules;
Support unified routing of digital signals, analog signals, and control signals.
Modular interface support
Design with multiple standard slots (such as VME, CPCI, etc.), supporting direct insertion of control cards, I/O cards, monitoring modules, etc;
Each slot has standardized signal/power interfaces, ensuring plug and play and easy maintenance.
Power distribution and protection
The backplane integrates power rails internally, which can provide stable power supply of different voltage levels (such as ± 12V,+5V,+3.3V) for multiple boards;
Simultaneously equipped with power overcurrent/short circuit protection mechanism to enhance the overall reliability of the system.
3、 Application Fields
Semiconductor equipment control system
The central control architecture used in TEL's adhesive development, etching, cleaning, heat treatment and other equipment;
Carrying multiple functional units such as control CPU board, I/O module, temperature control card, communication interface, etc.
Process automation control platform
As the main communication carrier in a multi board collaborative system, maintain a high bandwidth and high stability signal channel;
Support real-time response and multitasking in complex action processes.
Equipment maintenance and modular expansion
Easy to replace or expand functional boards without requiring significant changes to the device structure;
It is one of the essential structural components in the long-term operation of equipment.
2.產(chǎn) 品 展 示
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