Tokyo Electron 2L81-050097-13印刷電路板 PDF資料
1.產(chǎn) 品 資 料 介 紹:
中文資料:
TEL Tokyo Electron 2L81-050097-13 印刷電路板 是一塊專用于東京電子(TEL)半導(dǎo)體制造設(shè)備中的功能性 PCB 板卡,主要用于信號傳輸、控制邏輯執(zhí)行、或與執(zhí)行模塊的通信連接。該板卡為設(shè)備控制系統(tǒng)中的重要組成部分,具備高度集成性與穩(wěn)定性,常見于自動化系統(tǒng)、真空處理單元或工藝控制模塊內(nèi)部。
一、產(chǎn)品基本信息
項(xiàng)目 | 內(nèi)容 |
---|---|
產(chǎn)品型號 | 2L81-050097-13 |
產(chǎn)品名稱 | 印刷電路板(Printed Circuit Board) |
制造廠商 | Tokyo Electron Ltd.(東京電子) |
應(yīng)用類型 | 控制、通信、信號中繼 |
二、核心功能
信號連接與中轉(zhuǎn)
用于主控系統(tǒng)與下級執(zhí)行機(jī)構(gòu)之間的信號橋接;
支持多通道輸入輸出接口,連接傳感器、閥門、驅(qū)動器等設(shè)備組件。
控制邏輯處理
集成基礎(chǔ)邏輯電路或通信芯片,用于執(zhí)行特定控制任務(wù);
可能包括數(shù)字信號采集、模擬信號轉(zhuǎn)換、邏輯判斷等功能。
系統(tǒng)通信接口
實(shí)現(xiàn)與其他控制模塊或上位機(jī)的數(shù)據(jù)通信;
支持TEL設(shè)備內(nèi)部的標(biāo)準(zhǔn)數(shù)據(jù)協(xié)議或定制通信架構(gòu)。
三、典型應(yīng)用場景
晶圓處理設(shè)備內(nèi)部控制系統(tǒng)
應(yīng)用于TEL的涂膠顯影、蝕刻、清洗或熱處理設(shè)備中,作為功能模塊板卡;
與主控板或其他子模塊配合,完成特定的控制任務(wù)或信號傳遞。
自動化控制系統(tǒng)子模塊
用于電機(jī)驅(qū)動控制、壓力/溫度調(diào)節(jié)單元、真空閥門控制系統(tǒng)等;
支持自動化工藝過程中的各類子系統(tǒng)穩(wěn)定運(yùn)行。
設(shè)備維修與替換
作為標(biāo)準(zhǔn)模塊化組件,可在設(shè)備維護(hù)或升級過程中進(jìn)行替換;
保證老舊設(shè)備運(yùn)行持續(xù)性與控制系統(tǒng)一致性。
英文資料:
The TEL Tokyo Electron 2L81-050097-13 printed circuit board is a functional PCB board specifically designed for use in Tokyo Electronics (TEL) semiconductor manufacturing equipment. It is primarily used for signal transmission, control logic execution, or communication connections with execution modules. This board is an important component of the equipment control system, with high integration and stability. It is commonly used in automation systems, vacuum processing units, or process control modules.
1、 Basic Product Information
Project Content
Product model 2L81-050097-13
Product Name Printed Circuit Board
Manufacturer Tokyo Electron Ltd
Application type control, communication, signal relay
2、 Core functions
Signal connection and relay
Used for signal bridging between the main control system and subordinate executing agencies;
Supports multi-channel input/output interfaces, connecting components such as sensors, valves, drivers, etc.
Control logic processing
Integrate basic logic circuits or communication chips for executing specific control tasks;
It may include functions such as digital signal acquisition, analog signal conversion, and logic judgment.
System communication interface
Realize data communication with other control modules or upper computer;
Support standard data protocols or customized communication architectures within TEL devices.
3、 Typical application scenarios
Internal control system of wafer processing equipment
Applied in TEL's adhesive development, etching, cleaning, or heat treatment equipment as a functional module board;
Cooperate with the main control board or other sub modules to complete specific control tasks or signal transmission.
Automation control system submodule
Used for motor drive control, pressure/temperature regulation units, vacuum valve control systems, etc;
Support stable operation of various subsystems in automated process.
Equipment maintenance and replacement
As a standard modular component, it can be replaced during equipment maintenance or upgrade processes;
Ensure the continuity of operation of old equipment and consistency with control systems.
2.產(chǎn) 品 展 示
3.其他產(chǎn)品
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