HIER466513P111模塊卡件，ABB使用配置手冊(cè)
冷卻要求摩托羅拉MVME2603/2604系列單板計(jì)算機(jī)是規(guī)定、設(shè)計(jì)和測(cè)試以在進(jìn)氣情況下可靠運(yùn)行強(qiáng)制風(fēng)冷的溫度范圍為0°至55°C（32°至131°F）整個(gè)組件（基板和模塊）的速度通常為可通過使用100 CFM軸流風(fēng)機(jī)實(shí)現(xiàn)。溫度鑒定為在標(biāo)準(zhǔn)摩托羅拉VME系統(tǒng)機(jī)箱中執(zhí)行。25瓦負(fù)載電路板插入兩個(gè)卡槽中，每側(cè)一個(gè)，與測(cè)試板，以模擬高功率密度系統(tǒng)配置。
HIER466513P111模塊卡件放置一個(gè)由三個(gè)軸流風(fēng)機(jī)組成的總成，每個(gè)風(fēng)機(jī)的額定功率為100 CFMVME卡固定框架正下方。進(jìn)氣溫度為在風(fēng)扇組件和卡固定框架之間測(cè)量，其中輸入氣流首先遇到被測(cè)模塊。執(zhí)行測(cè)試軟件由于模塊受到環(huán)境溫度變化的影響。案例關(guān)鍵的高功率密度集成電路的溫度是監(jiān)控以確保不超過組件供應(yīng)商的規(guī)格。而冷卻所需的確切風(fēng)量取決于環(huán)境空氣溫度和電路板的類型、數(shù)量和位置，以及對(duì)于其他熱源，通?？梢允褂?0 CFM實(shí)現(xiàn)充分冷490線性調(diào)頻流過模塊。需要更少的氣流來冷卻具有較低最大環(huán)境的環(huán)境中的模塊。在“更多”下良好的熱條件下，可以操作模塊在高于55°C且氣流增加的情況下可靠運(yùn)行。值得注意的是除了空氣動(dòng)力裝置的額定CFM外，還有幾個(gè)因素，這決定了空氣流過管道的實(shí)際體積和速度單元規(guī)格表A-1列出了MVME2603/2604基座的一般規(guī)范董事會(huì)。后續(xù)章節(jié)詳細(xì)介紹了冷卻要求和FCC順從MVME2603/2604基板的完整功能說明見第3章，功能描述。技術(shù)規(guī)范可選PCI夾層可在以下各項(xiàng)的文檔中找到：模塊。表A-1。MVME2603/2604規(guī)格特性規(guī)范功率要求（不包括過渡模塊，鍵盤、鼠標(biāo)）
+5V DC（±5%），典型5A，最大7A（MPC603處理器）；6A典型，最大8A（MPC604處理器）+12V DC（±5%），典型250mA，1A最大值–12V DC（±5%），典型100mA，最大250mA
Cooling Requirements
The Motorola MVME2603/2604 family of single board computers is
specified, designed, and tested to operate reliably with an incoming air
temperature range from 0° to 55° C (32° to 131° F) with forced air cooling
of the entire assembly (base board and modules) at a velocity typically
achievable by using a 100 CFM axial fan. Temperature qualification is
performed in a standard Motorola VME system chassis. 25-watt load
boards are inserted in two card slots, one on each side, adjacent to the
board under test, to simulate a high power density system configuration.
An assembly of three axial fans, rated at 100 CFM per fan, is placed
directly under the VME card cage. The incoming air temperature is
measured between the fan assembly and the card cage, where the incoming
airstream first encounters the module under test. Test software is executed
as the module is subjected to ambient temperature variations. Case
temperatures of critical, high power density integrated circuits are
monitored to ensure component vendors’ specifications are not exceeded.
While the exact amount of airflow required for cooling depends on the
ambient air temperature and the type, number, and location of boards and
other heat sources, adequate cooling can usually be achieved with 10 CFM
and 490 LFM flowing over the module. Less airflow is required to cool the
module in environments having lower maximum ambients. Under more
favorable thermal conditions, it may be possible to operate the module
reliably at higher than 55° C with increased airflow. It is important to note
that there are several factors, in addition to the rated CFM of the air mover,
which determine the actual volume and speed of air flowing over a
module.Specifications
Table A-1 lists the general specifications for MVME2603/2604 base
boards. Subsequent sections detail cooling requirements and FCC
compliance.
A complete functional description of the MVME2603/2604 base boards
appears in Chapter 3, Functional Description. Specifications for the
optional PCI mezzanines can be found in the documentation for those
modules.
Table A-1. MVME2603/2604 Specifications
Characteristics Specifications
Power requirements
(Excluding transition module,
keyboard, mouse)
+5V DC (±5%), 5A typical, 7A maximum
(MPC603 processor); 6A typical,
8A maximum (MPC604 processor)
+12V DC (±5%), 250mA typical,
1A maximum
–12V DC (±5%), 100mA typical,
250mA maximum
